Die attach process is one of the most critical process in semiconductor industry. In this process, die pick up tips or rubber tips have been used tremendously. Thus, the quality, reliability and high standard of die pick up tips/ rubber tips are required for the process to ensure the effectiveness of picking up die are stable in any circumstance.
Our die pick up tips series’ capability are up to 0.1 mm. vacuum through hole and able to tailor made die pick up tips upon the customer special requirement.